Title: STUDY OF POLYAMIDE-IMIDE RESIN/COPPER FOIL COMPOSITE MATERIALS
Page Range: p.57-67
Author(s): Chou S; Lee K-S
File size: 352K
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Journal: Polymers and Polymer Composites
Issue Year: ppc
Volume: 11
Issue No: No. 1
Abstract
In this research, monomers such as 3,4′-oxydianiline (3,4′-ODA) and p-aminobenzoic acid were used to synthesise a high temperature resistant polyamide-imide resin, and the NHCO (amide) group was introduced into the molecular chain to improve the resin’s melt flow, solubility and adhesion. Also, without using any coupling agent, two layers of copper foil laminate were formed by hot press gluing. Tests for void content, moisture content, adhesive bond moisture resistance, heat and chemical resistance, dielectric constant, dissipation factor, and surface analysis were carried out to evaluate the properties of the laminates for heat resistant, high performance applications. 13 refs.
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