Title: SYNTHESIS AND PROPERTIES OF AMIDE-CONTAINING BISNADIMIDE COPPER FOIL COMPOSITES
Page Range: p.197-212
Author(s): Chou S; Lee K-S
File size: 215K
Download the pdf (subscribers only)
Buy the pdf (non-subscribers)
Journal: Polymers and Polymer Composites
Issue Year: ppc
Volume: 11
Issue No: No. 3
Abstract
The need for increased heat resistance in printed circuit boards, has led to the development of modified polyimides for use in coating copper foils to form laminates. This work reports the introduction of the amide (-NHCO-) group in to the molecular chain to improve the flexibility and solubility of polyimides. Nadic anhydride was used to synthesise an end-capped low molecular weight polyamide-imide polymer. The amide-containing bisnadimide resin can be used as an adhesive in a hot press with the copper foil to form laminates. 13 refs.
Related reading
More journal reading and science coverage connected to this topic.
Mechanical properties of glass bead-modified polymer composite
Title: Mechanical properties of glass bead-modified polymer composite Page Range: p.35-44 Author(s): Tsung-Han Hsieh; Ming-Yuan Shen; Yau-Shian Huang; Qi-Qian He; Hsuan-Chih Chen File size:…
The effect of MBS toughening for mechanical properties of wood-plastic composites under environmental ageing
Title: The effect of MBS toughening for mechanical properties of wood-plastic composites under environmental ageing Page Range: p.45-58 Author(s): Chin-Hsing Chen; Chin-Lung Chiang; Wei-Jen…
Characterization and properties of graphene nanoplatelets/XNBR nanocomposites
Title: Characterization and properties of graphene nanoplatelets/XNBR nanocomposites Page Range: p.59-68 Author(s): Chen-Feng Kuan; Chin-Lung Chiang; Su-Hsia Lin; Wei-Guo Huang; Wen-Yen Hsieh; Ming-Yuan Shen…