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Polymers and Polymer Composites

NUMERICAL ANALYSIS FOR THE INTERLAYER TOUGHENING OF PIEZOELECTRIC SMART COMPOSITE PLATE

February 1, 2014 By: Bai Rui-xiang; Bai Haitong; Wang Mingchao Research article

Title: NUMERICAL ANALYSIS FOR THE INTERLAYER TOUGHENING OF PIEZOELECTRIC SMART COMPOSITE PLATE
Page Range: p.193-202
Author(s): Bai Rui-xiang; Bai Haitong; Wang Mingchao
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Journal: Polymers and Polymer Composites
Issue Year: ppc
Volume: 22
Issue No: No. 2

Abstract
The piezoelectric composite material could engender stress concentration resulting from small cracks during layers easily, as the cracks growth will lead to the failure of the whole structure. In this paper, a finite element model for piezoelectric composite materials by ABAQUS including interlayer crack was established, and the J integral and crack tip stress of different types PZT patches were calculated by using the equivalent integral method. Then, the J integral for adhesive layers with different thickness, elastic modulus considering and not considering piezoelectricity was investigated. The results show that the J integral of mode I, II reduces with thicker adhesive layer and lower elastic modules, and the J integral of mode II decreases more sharply than that of mode I. 22 Refs.

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