Title: CURING BEHAVIOUR OF EPOXY RESIN WITH A DIAMINE CONTAINING HETEROCYCLIC RINGS
Page Range: p.469-474
Author(s): Lu X D; Huang Y D; Zhang C H
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Journal: Polymers and Polymer Composites
Issue Year: ppc
Volume: 15
Issue No: No.6
Abstract
The curing behaviour of diglycidyl-4,5-epoxycyclohexane-1,2-dicarboxylate with 2,6-di(p-aminophenyl)benzo(1,2,5,4)bisoxazole as a novel curing agent and with mixtures thereof with diaminodiphenylsulphone was investigated by DSC and compared with that of diaminodiphenylsulphone alone. The Tgs and heat stabilities of the cured epoxy resins were determined by torsional braid analysis, DSC and TGA and average apparent activation energies of the curing reactions calculated using the Kissinger and Ozawa methods. The epoxy resin cured with the new curing agent showed higher cure temperatures and apparent activation energies than that cured with diaminodiphenylsulphone. 16 refs.
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