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Polymers and Polymer Composites

AMIDE-CONTAINING BISMALEIMIDE RESINS AND THEIR COPPER FOIL COMPOSITE MATERIALS

January 1, 2005 By: Meng-Shun Huang; Ming-Chien Yang; Shen Chou Research article

Title: AMIDE-CONTAINING BISMALEIMIDE RESINS AND THEIR COPPER FOIL COMPOSITE MATERIALS
Page Range: p.37-52
Author(s): Meng-Shun Huang; Ming-Chien Yang; Shen Chou
File size: 425K
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Journal: Polymers and Polymer Composites
Issue Year: ppc
Volume: 13
Issue No: No. 1

Abstract
Amide-containing bismaleimide (ACBI) resins were prepared using four monomeric reactants: 3,4′-oxydialine, trimellitic anhydride, maleic anhydride, and 4-aminobenzoic acid. The chemical structures were characterised using elemental analysis and FTIR. The peel strength, dielectric constant, dissipation factor, heat resistance, and chemical resistance were studied. Experimental results show that the optimal hot-press conditions for ACBI/copper foil laminates was 320 degrees C and 4.9 MPa. ACBI laminates treated with 0.2% NZ97 coupling agent were shown to have the highest peel strength of 2.097 kN/m. After 24 hours at 300 degrees C, the peel strength was 1.568 kN/m, the 1 MHz dielectric constant of ACBI was 3.48, and the dissipation factor was 0.0082. Following a hot/wet treatment for 72 hours, ACBI laminates maintained 76% of their original peel strength. After treating in 10% sulphuric acid solution at 60 degrees C for 30 minutes, ACBI laminates were shown to have maintained 88% of their original peel strength. 16 refs.

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