# SYNTHESIS AND PROPERTIES OF AMIDE-CONTAINING BISNADIMIDE COPPER FOIL COMPOSITES

> Title: SYNTHESIS AND PROPERTIES OF AMIDE-CONTAINING BISNADIMIDE COPPER FOIL COMPOSITES Page Range: p.197-212 Author(s): Chou S; Lee K-S File size: 215K Download the pdf (subscribers only) Buy the pdf (non-subscribers) Journal: Polymers and Polymer Composites Issue Year: ppc Volume: 11 Issue No:...

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Published: 2003-03-01T00:00:00+00:00
Categories: Polymers and Polymer Composites

**Title: SYNTHESIS AND PROPERTIES OF AMIDE-CONTAINING BISNADIMIDE COPPER FOIL COMPOSITES**
 Page Range: p.197-212
 Author(s): Chou S; Lee K-S
 File size: 215K
 ![](http://dload.gif) [Download the pdf](http://journals.asp?Page=111&JournalDownload=ON&JournalType=ppc&JournalIssue=ppc11-3&JournalID=100073&JIP=) (subscribers only)
 ![](http://handbuy.gif) Buy the pdf (non-subscribers)
 Journal: Polymers and Polymer Composites
 Issue Year: ppc
 Volume: 11
 Issue No: No. 3

**Abstract**
 The need for increased heat resistance in printed circuit boards, has led to the development of modified polyimides for use in coating copper foils to form laminates. This work reports the introduction of the amide (-NHCO-) group in to the molecular chain to improve the flexibility and solubility of polyimides. Nadic anhydride was used to synthesise an end-capped low molecular weight polyamide-imide polymer. The amide-containing bisnadimide resin can be used as an adhesive in a hot press with the copper foil to form laminates. 13 refs.

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