# STUDY OF POLYAMIDE-IMIDE RESIN/COPPER FOIL COMPOSITE MATERIALS

> Title: STUDY OF POLYAMIDE-IMIDE RESIN/COPPER FOIL COMPOSITE MATERIALS Page Range: p.57-67 Author(s): Chou S; Lee K-S File size: 352K Download the pdf (subscribers only) Buy the pdf (non-subscribers) Journal: Polymers and Polymer Composites Issue Year: ppc Volume: 11 Issue No: No. 1...

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Published: 2003-01-01T00:00:00+00:00
Categories: Polymers and Polymer Composites

**Title: STUDY OF POLYAMIDE-IMIDE RESIN/COPPER FOIL COMPOSITE MATERIALS**
 Page Range: p.57-67
 Author(s): Chou S; Lee K-S
 File size: 352K
 ![](http://dload.gif) [Download the pdf](http://journals.asp?Page=111&JournalDownload=ON&JournalType=ppc&JournalIssue=ppc11-1&JournalID=100058&JIP=) (subscribers only)
 ![](http://handbuy.gif) Buy the pdf (non-subscribers)
 Journal: Polymers and Polymer Composites
 Issue Year: ppc
 Volume: 11
 Issue No: No. 1

**Abstract**
 In this research, monomers such as 3,4'-oxydianiline (3,4'-ODA) and p-aminobenzoic acid were used to synthesise a high temperature resistant polyamide-imide resin, and the NHCO (amide) group was introduced into the molecular chain to improve the resin's melt flow, solubility and adhesion. Also, without using any coupling agent, two layers of copper foil laminate were formed by hot press gluing. Tests for void content, moisture content, adhesive bond moisture resistance, heat and chemical resistance, dielectric constant, dissipation factor, and surface analysis were carried out to evaluate the properties of the laminates for heat resistant, high performance applications. 13 refs.

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