# PREPARATION AND PROPERTIES OF THERMOPLASTIC POLYAMIDE-IMIDE AND POLYUREA-AMIDE-IMIDE/COPPER FOIL COMPOSITES

> Title: PREPARATION AND PROPERTIES OF THERMOPLASTIC POLYAMIDE-IMIDE AND POLYUREA-AMIDE-IMIDE/COPPER FOIL COMPOSITES Page Range: p.777-794 Author(s): Meng-Shun Huang; Ming-Chien Yang; Shen Chou File size: 258K Download the pdf (subscribers only) Buy the pdf (non-subscribers) Journal: Polymers and Polymer Composites Issue Year: ppc Volume:...

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Published: 2005-08-01T00:00:00+00:00
Categories: Polymers and Polymer Composites

**Title: PREPARATION AND PROPERTIES OF THERMOPLASTIC POLYAMIDE-IMIDE AND POLYUREA-AMIDE-IMIDE/COPPER FOIL COMPOSITES**
 Page Range: p.777-794
 Author(s): Meng-Shun Huang; Ming-Chien Yang; Shen Chou
 File size: 258K
 ![](http://dload.gif) [Download the pdf](http://journals.asp?Page=111&JournalDownload=ON&JournalType=ppc&JournalIssue=ppc13-8&JournalID=100252&JIP=) (subscribers only)
 ![](http://handbuy.gif) Buy the pdf (non-subscribers)
 Journal: Polymers and Polymer Composites
 Issue Year: ppc
 Volume: 13
 Issue No: No. 8

**Abstract**
 Polyimides are used extensively in printed circuit boards, but their applications have been limited due to their high softening temperatures and their insoluble nature in most organic solvents. Polyamide-imide and polyurea-imide resins have been developed to overcome these disadvantages. They include amide and urea groups respectively in their main chains to improve solubility and adhesion. In this paper, polyamide-imide (PAI) and polyurea-amide-imide (PUAI) resins were polymerised from five reactants: 4,4'-oxydianiline, 4-nitrobenzoyl chloride, 4,4'-diphenylmethane diisocyanate, 1,2,4,5-benzenetetracarboxylic dianhydride, and 3,3'-4,4'-benzophenone tetracarboxylic dianhydride. Their chemical structures were characterised using elemental analysis, FTIR and high nuclear magnetic resonance. Thermal properties, adhesive properties, electrical properties, heat resistance, and chemical resistance were also studied. Results indicate the suitability of these materials for use in the manufacture of flexible printed circuit boards. 20 refs.

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